-
1 wet oxidation
оксидування в атмосфері вологого кисню; оксидування в парі водиEnglish-Ukrainian dictionary of microelectronics > wet oxidation
-
2 oxidation
оксидування, окислення - catalytic oxidation
- controlled oxidation
- dry oxidation
- electrolytic oxidation
- field oxidation
- gate oxidation
- heat oxidation
- high-pressure oxidation
- interlevel oxidation
- laser-induced oxidation
- lateral oxidation
- low-temperature oxidation
- open-tube oxidation
- planar oxidation
- plasma oxidation
- selective oxidation
- self-terminating oxidation
- steam oxidation
- surface-wide oxidation
- thermal oxidation
- ultra-violet laser oxidation
- wet oxidationEnglish-Ukrainian dictionary of microelectronics > oxidation
-
3 masking
1) маскування 2) літографія - dry masking
- metallization masking
- nitride masking
- optical masking
- oxidation masking
- oxide masking
- photo masking
- photoresist masking
- projection masking
- reticle masking
- selective photoresist masking
- selective masking
- silicon-dioxide masking
- wet masking -
4 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
5 reaction
реакція; взаємодія - enhancement-type reaction
- gaseous-phase reaction
- heterogenous reaction
- ion-induced surface reaction
- liquid-phase reaction
- liquefaction reaction
- oxidation reaction
- photochemical reaction
- photodissociation reaction
- photo-induced surface reaction
- plasma reaction
- precursor reaction
- pyrolytic CVD reaction
- radical reaction
- redox reaction
- reduction reaction
- solid-state reaction
- substitution reaction
- transport reaction
- vapor-phasereaction
- vaporreaction
- wet reaction -
6 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
См. также в других словарях:
Wet oxidation — is a form of hydrothermal treatment. It is the oxidation of dissolved or suspended components in water using oxygen as the oxidizer. It is referred to as Wet Air Oxidation (WAO) when air is used. The oxidation reactions occur in superheated water … Wikipedia
wet oxidation — drėgnasis oksidavimas statusas T sritis radioelektronika atitikmenys: angl. wet oxidation vok. Feuchtoxydation, f rus. оксидирование в атмосфере влажного кислорода, n pranc. oxydation sous oxygène liquide, f … Radioelektronikos terminų žodynas
Thermal oxidation — In microfabrication, thermal oxidation is a way to produce a thin layer of oxide (usually silicon dioxide) on the surface of a wafer (semiconductor). The technique forces an oxidizing agent to diffuse into the wafer at high temperature and react… … Wikipedia
Supercritical water oxidation — or SCWO is a process that occurs in water at temperatures and pressures above a mixture s thermodynamic critical point. Under these conditions water becomes a fluid with unique properties that can be used to advantage in the destruction of… … Wikipedia
Thermische Oxidation von Silizium — Die thermische Oxidation von Silizium ist in der Halbleitertechnik ein Beschichtungsverfahren, bei dem auf einem einkristallinen Siliziumsubstrat (beispielsweise einem Silizium Wafer) eine dünne Schicht aus amorphen Siliziumdioxid aufgebracht… … Deutsch Wikipedia
Oxydation par voie humide — L’oxydation par voie humide est un traitement des déchets aqueux contenant des composés organiques. Le traitement a lieu à haute température et haute pression dans des conditions sous critiques. Ce procédé est notamment utilisé pour traiter les… … Wikipédia en Français
Superheated water — is liquid water under pressure at temperatures between the usual boiling point (100°C) and the critical temperature (374°C). It is also known as subcritical water and pressurised hot water. Superheated water referred to in this article is stable… … Wikipedia
Silicon dioxide — Silica redirects here. For other uses, see Silica (disambiguation). Silicon dioxide … Wikipedia
Fick's law of diffusion — Fick s laws of diffusion describe diffusion and can be used to solve for the diffusion coefficient D . They were derived by Adolf Fick in the year 1855. First law Fick s first law relates the diffusive flux to the concentration field, by… … Wikipedia
List of waste water treatment technologies — The following page consist of a list of waste water treatment technologies: * Activated sludge systems [ [http://www.oost vlaanderen.be/docs/nl/gc/35447.%20afvalwaterzuivering%20op%20landbouwbedrijven.pdf Overview of activated sludge system with… … Wikipedia
Fick's laws of diffusion — For the technique of measuring cardiac output, see Fick principle. Molecular diffusion from a microscopic and macroscopic point of view. Initially, there are solute molecules on the left side of a barrier (purple line) and none on the right. The… … Wikipedia
